EnSilica plc (LSE:ENSI) has secured a new application-specific integrated circuit (ASIC) development and supply agreement worth approximately $2.4 million with a US healthcare technology company, while completing a key development milestone on a separate $1.6 million life-sciences contract.
The semiconductor design specialist said the new healthcare agreement follows the successful completion of a feasibility study announced in March 2026 and covers the development of a wireless biosensing and therapeutic controller chip.
Separately, EnSilica has completed the tape-out of a next-generation ASIC for a UK-listed life-sciences technology company, allowing the design to progress to semiconductor fabrication.
Both programmes were originally announced on 10 March 2026 and represent progress in EnSilica’s healthcare and life-sciences semiconductor activities.
Healthcare Feasibility Study Converts Into $2.4 Million Contract
EnSilica has converted an initial feasibility study with a US healthcare technology customer into a full ASIC development and supply agreement.
The contract is expected to generate approximately $2.4 million in development revenue over an anticipated 18-month programme.
The project involves designing a wireless biosensing and therapeutic controller ASIC intended for use in a medical device that incorporates cloud-based artificial intelligence.
The customer’s technology is being developed to support the treatment of a widespread chronic medical condition affecting tens of millions of people in the United States and hundreds of millions globally.
EnSilica has not disclosed the customer’s identity or the specific medical condition being targeted.
The company will undertake the complete ASIC development programme, moving the project beyond its initial feasibility stage towards a chip suitable for the customer’s intended application.
The agreement also establishes a framework for EnSilica to supply the semiconductor over the commercial lifetime of the customer’s product.
Potential for Recurring Revenue From Healthcare Chip Supply
The healthcare contract provides EnSilica with an initial development revenue opportunity and the potential to generate additional income through future chip production and supply.
Under the agreement, EnSilica will develop the ASIC over approximately 18 months, with subsequent supply arrangements linked to the customer’s commercialisation plans.
The company said the medical condition targeted by the customer’s device represents a substantial potential market because of the number of patients affected worldwide.
If development is successful and the device receives the necessary regulatory approvals, commercial adoption could create demand for significant ASIC production volumes.
However, future supply revenue will depend on the customer’s ability to bring the product to market and achieve commercial sales.
EnSilica has not disclosed any committed production volumes or the potential financial value of long-term chip supply.
The $2.4 million contract value relates to the development programme rather than guaranteed future manufacturing revenue.
UK Life-Sciences ASIC Completes Tape-Out
EnSilica has also completed the tape-out of an ASIC being developed for a publicly quoted UK life-sciences technology company.
The milestone forms part of a previously announced contract valued at approximately $1.6 million.
The agreement covers design implementation, tape-out management and prototype wafer manufacturing services for a semiconductor intended for use in advanced life-science analysis systems.
Tape-out marks the completion of the chip design stage and its preparation for semiconductor fabrication.
With this stage completed, the ASIC is progressing to manufacturing at a leading semiconductor foundry.
EnSilica will continue supporting the customer through wafer fabrication and subsequent production activities.
The company expects the majority of revenue associated with the $1.6 million contract to be recognised during its financial year ending 31 May 2027.
Life-Sciences Programme Offers Further Manufacturing Opportunities
The completion of tape-out represents a development milestone for EnSilica’s UK life-sciences customer.
The programme is now moving from design implementation into physical semiconductor manufacturing, with prototype wafer production forming part of the existing agreement.
EnSilica will remain involved as the chip progresses through fabrication and towards production.
The company said the contract could also lead to additional long-term revenue through future production wafer supply.
Any such revenue would depend on the customer’s subsequent manufacturing requirements and commercial plans.
No committed future production volumes or additional supply contract values have been disclosed.
The development highlights EnSilica’s involvement across multiple stages of semiconductor projects, from initial design through to fabrication support and potential production supply.
Healthcare and Life-Sciences Projects Support ASIC Business Model
The two programmes demonstrate different stages of EnSilica’s ASIC development and supply activities.
The US healthcare agreement has progressed from feasibility assessment to a full development programme, while the UK life-sciences project has completed design tape-out and is advancing towards fabrication.
Together, the contracts represent approximately $4 million in announced development and related service values, comprising the new $2.4 million healthcare agreement and the previously disclosed $1.6 million life-sciences contract.
These amounts relate to separate projects and should not be interpreted as $4 million of newly awarded business.
Both arrangements also provide potential opportunities for future semiconductor supply beyond the initial development work.
EnSilica’s fabless operating model allows the company to design application-specific chips and coordinate manufacturing through external semiconductor foundries.
The company is seeking to establish longer-term customer relationships that can extend from development services into recurring ASIC or wafer supply.
Chief Executive Highlights Progress on Both Contracts
EnSilica Chief Executive Officer Ian Lankshear welcomed the conversion of the healthcare feasibility study into a full development agreement and the completion of the UK life-sciences tape-out.
“We are delighted to have converted the feasibility study for our healthcare customer, announced in March, into a multi-year development and supply agreement. The scale of the market for the customer’s device is clear, creating the potential for significant chip volumes as the product progresses towards commercialisation.
“Additionally, completing tape-out for our UK life-sciences ASIC is another important milestone, underlining our team’s ability to execute complex design and manufacturing chip programmes, and to deliver against customer commitments.”
The company views both developments as evidence of progress in delivering semiconductor programmes for customers operating in healthcare and life-sciences markets.
EnSilica Outlook
EnSilica’s latest contract announcements provide further visibility over its ongoing ASIC development activities.
The new $2.4 million US healthcare agreement is expected to run for approximately 18 months and establishes a potential route to future chip supply revenue.
Meanwhile, the UK life-sciences programme has entered the fabrication stage, with most of its existing $1.6 million contract revenue expected to be recognised during the financial year ending 31 May 2027.
Both projects could generate additional manufacturing-related revenue if their respective customers progress successfully towards commercial production.
However, future supply volumes remain dependent on development outcomes, customer requirements, regulatory approvals where applicable and commercial adoption.
The immediate focus will be on delivering the healthcare development programme and supporting the life-sciences ASIC through wafer manufacturing and towards production.
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